Senior PCB Design Engineer

Who You’ll Work With Working closely with cross-functional teams including Hardware Design, Signal Integrity (SI), Power Integrity (PI), Mechanical Engineering, Thermal Engineering, and Manufacturing, our engineers innovate on system architectures and ultra-high-speed PCB designs to deliver state-of- the-art networking platforms. What You'll Do Our Hardware Design Engineering team is at the forefront of developing high-speed networking and Ethernet products used in enterprise campuses, hyperscale datacenters, and next-generation AI clusters. The team is responsible for end-to-end design and development of advanced hardware solutions that meet the demands of modern networking environments — including optical interface platforms up to 800G and 1.6T. Core Responsibilities  High-Speed Layout & Routing Implement complex routing for advanced interfaces such as 112G/224G SerDes, PCIe Gen 5/6, DDR4/5/6 Design and route high-speed differential pairs with tight skew and impedance control Execute dense BGA fan-out for high-pin-count ASICs and FPGAs Optical Transceiver PCB Layout (800G / 1.6T) Design and layout boards supporting high-bandwidth optical transceivers (QSFP-DD, OSFP, OSFP-XD or equivalent) Route 112G / 224G PAM4 electrical channels between switch ASICs and optical modules Define insertion loss budgets and coordinate with SI engineers to meet IEEE compliance requirements Optimize breakout routing beneath high-density optical cages Implement via stub mitigation strategies including backdrilling for ultra-high-speed signal paths Manage ground reference continuity, EMI control, and return path integrity near optical connectors Consider thermal dissipation (20W–30W+ modules) in layout planning Impedance Control & Signal Integrity Design advanced multi-layer stack-ups (20–30+ layers) Calculate impedance profiles and ensure low-reflection, low-crosstalk performance Collaborate with SI teams on channel modeling and pre-/post-layout simulations Power Integrity (PI) Optimization Design robust Power Distribution Networks (PDNs) for high-current ASICs Layout multi-phase DC/DC converters for high transient loads Strategically place decoupling capacitors to ensure wideband impedance stability Thermal & Mechanical Coordination Integrate thermal vias, heat sink attachments, and high-conductivity materials Coordinate mechanical constraints such as enclosure, airflow, and structural limitations Ensure proper placement and structural integration of optical cages Advanced Fabrication Deliverables Generate comprehensive manufacturing packages (Gerber, ODB++, IPC-2581) Define backdrilling parameters and impedance specifications Ensure compliance with DFM, DFA, and DFT requirements Support boards through fabrication, assembly, and production ramp Library & Feasibility Ownership Create and maintain high-density component footprints (e.g., large BGAs, optical module connectors) Participate in new product feasibility studies Develop detailed routing guidelines and work packages for layout partners Review external placement and routing work to ensure quality and schedule adherence Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or related field 10+ years of relevant hardware engineering experience Proven experience designing networking hardware, particularly involving 100G/200G PAM4 Ethernet switching Direct experience in high-speed optical transceiver PCB layout (800G and/or 1.6T preferred) Expertise with 112G / 224G PAM4 routing and channel optimization Advanced proficiency in Cadence Allegro and Sigrity Experience designing 20+ layer boards with 50G+ signals Hands-on experience with sequential lamination, HDI, ultra-low-loss materials Experience in multi-phase DC/DC layout for high-current, high transient loads Strong manufacturing knowledge including DFM, DFA, and DFT for 30+ layer rigid and rigid-flex boards Demonstrated success taking products from concept thr ... (truncated, view full listing at source)