Engineering Manager, Silicon Assembly (Starlink)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. ENGINEERING MANAGER, SILICON ASSEMBLY (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world.  In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, design engineers, test engineers, hardware reliability teams, equipment manufacturers and management to introduce novel products and processes, as well as drive operational efficiency and continuous improvement through the high-performance teams you cultivate and develop through engaged and decisive leadership. The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment, thrive on solving difficult problems where resolutions have high impact, and love the challenge of building something from scratch, then this role will be an ideal next career step. RESPONSIBILITIES: Lead a rapidly expanding (10-20) team of multi-disciplinary manufacturing engineers specialists spanning automation/controls, photolithography (develop and imaging), thin films, dry films (lamination), electrochemical plating, etch (wet dry), compression molding, singulation (wafer sort panel saw), die attach ball grid array attach, RF test Collaborate with production, development/process engineering, and supply chain teams to identify equipment needs and develop solutions that improve yield, reduce cycle times, improve efficiency, and minimize downtime in silicon packaging manufacturing lines Implement data-driven improvements using Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), and formalize comprehensive Out of Control Action Plan (OCAP) procedures by module to maintain extreme ownership of robust high-volume automated manufacturing lines Conduct regular reviews of assembly and test yields, conduct root cause analysis, oversee/implement corrective actions for product non-conformance, and drive overall quality metrics to 3-sigma repeatability Ensure compliance with industry standards (e.g., ISO, SEMI, JEDEC) and SpaceX safety protocols, while fostering culture of continuous improvement, operational excellence, and high-performance Mentor and develop team members, conduct performance reviews, and hire top talent to build a world-class manufacturing engineering group BASIC QUALIFICATIONS: Bachelor's degree in an engineering discipline 5+ years of experience in semiconductor process engineering, manufacturing, or automation 2+ years in a leadership or management role PREFERRED SKILLS AND EXPERIENCE: Advanced degree (master's or PhD) in a relevant engineering discipline (mechanical engineering, electrical engineering, chemical engineering) Experience in the semiconductor industry, integrated circuitry industry (FPGA, ASIC, high power components), or experience leading new product integration Experience with the equipment and support systems used to manufacture semiconductors (front-end wafer and back-end packaging) Experience with equipment qualification, validation, and troubleshooting in cleanroom or controlled environments Proficiency in programming for automation (e.g. structured text, ladder logic, C++) and simulation tools (e.g., MATLAB, LabVIEW) Demonstrated ability to manage budgets exceeding $10M and leading multidisciplinary teams in agile development cycles Excellent communication skills with experience presenting technical concepts to non-technical stakeho ... (truncated, view full listing at source)