LTD BE Etch Module Development Engineer

Intel
US, Oregon, Hillsboro$134k – $189kPosted 27 March 2026

Job Description

Job Details: Job Description: You will operate in a high‑impact space, partnering closely with cross‑functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long‑term systems that sustain performance. Note: This role requires regular onsite presence to fulfill essential job responsibilities. Key Responsibilities (may include but are not limited to) Lead FOK tool installation, development, and qualification for Back End Etch modules; drive readiness from early development through qualification and sustained performance. Identify variation sources and create improvement plans. Own and drive development of next‑generation patterning processes , including process architecture, optimization strategies, and qualification methodologies. Provide technical leadership for cross‑functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions. Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle. Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems). Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture). Drive improvements in yield, reliability, cost, productivity, and process capability , ensuring scalable transfer to manufacturing and ongoing sustainment. Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders. Behavioral Traits (Ideal Candidate) Strong technical leadership and a track record of rapid analysis of complex issues with clear decision making. Ability to drive alignment across cross‑functional teams and execute under ambiguity. Excellent written/verbal communication; able to translate complex data into actionable recommendations. Ownership mindset with disciplined execution and attention to operational excellence. Qualifications: Minimum Qualifications: Bachelor’s degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, Chemistry, or related STEM field plus relevant industry experience ; or Master’s/PhD with commensurate experience. Demonstrated experience leading semiconductor process development, qualification, and/or manufacturing ramp/sustainment. Proven ability to plan/lead experimentation, data analysis, and control strategy development. Willingness and ability to work onsite regularly to support tool and process development needs. Preferred Qualifications: Extensive experience in developing etch and patterning processes, as well as in defect or yield engineering. Possesses a thorough knowledge of plasma physics or chemistry. Demonstrated experience leading FOK tool bring‑up/qualification and partnering with suppliers. Strong background in SPC/DOE/FMEA and advanced analytics (JMP/SQL/Python). Experience establishing long‑term sustaining systems (controls, governance, monitoring, standard work) that prevent recurrence of chronic issues. Primary Location US, Oregon, Hillsboro Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to fin ... (truncated, view full listing at source)
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