Module Development Engineering Manager
IntelUS, Oregon, Hillsboro$156k – $220kPosted 27 March 2026
Job Description
Job Details:
Job Description:
The Role and Impact:
Join Intel's Module Development Engineering team as a Manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key driver of Intel's technological advancement, you will play a pivotal role in ensuring the successful development, transfer, and implementation of cutting-edge technologies that enable Intel's leadership in power performance, structural efficiency, and cost optimization. With a focus on driving results and fostering collaboration across multiple organizational boundaries, this role offers an opportunity to make a significant impact on Intel's global manufacturing capabilities and future technological roadmap.
Key Responsibilities:
- Lead a team of module development engineers to develop, implement, and transfer advanced technology solutions.
- Define and oversee technology roadmaps for the module, ensuring alignment with Intel's strategic goals.
- Manage resources, set priorities, and foster collaboration across teams to meet project schedules and maximize operational outcomes.
- Partner with integration, device, and yield engineering teams to develop robust process solutions that deliver power performance and area leadership.
- Build and maintain partnerships with supplier executive management to nurture unique industry ideas and research innovations.
- Coach and mentor engineering teams in pathfinding and technology road mapping for advanced technology development.
- Develop long-term strategies for module engineering capabilities to support emerging technological requirements.
- Ensure accountability and drive team results by setting clear goals, performance benchmarks, and maintaining alignment with Intel's values.
- Promote an inclusive and productive work environment while inspiring individuals and developing their professional capabilities.
Professional traits:
Proven track record of managing engineering teams and driving cross-functional collaboration.
Qualifications:
Minimum Qualifications:
- Bachelor's degree in Engineering, Materials Science, Physics, or related fields with 6 years of experience in a technical leadership role or metrology tool ownership.
- Master's degree in Engineering, Materials Science, Physics, or related fields with 4 years of experience.
- PhD in Optics, Physics, Engineering, Materials Science, or related fields with 2 years of experience.
The year of experience must include:
- Demonstrated expertise in optical characterization, scripting, statistics, data analytics, and problem solving.
- Leadership experience in managing engineering team and driving results in complex environments
Preferred Qualifications:
- Experience in Metrology and defect inspections equipment, semiconductor fabrication, packaging technologies, or advanced module engineering.
- Strong technical understanding and ability to distill conflicting data inputs into actionable solutions.
- Familiarity with wafer equipment, processes, or singulation techniques.
We invite you to bring your expertise, leadership, and innovation to Intel, where you will have the opportunity to shape the future of technology and achieve meaningful professional growth.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technol ... (truncated, view full listing at source)
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