Electromechanical Engineer, Robotics R&D

Dyna Robotics
Redwood City, CAPosted 31 March 2026

Tech Stack

Job Description

Electromechanical Engineer, Robotics R&D JOIN US TO SHAPE THE NEXT FRONTIER OF AI-DRIVEN ROBOTICS! Dyna Robotics makes general-purpose robots powered by a proprietary embodied AI foundation model that generalizes and self-improves across varied environments with commercial-grade performance. Dyna's robots have been deployed at customers across multiple industries. Its frontier model has the top generalization and performance in the industry. Dyna Robotics was founded by repeat founders Lindon Gao and York Yang, who sold Caper AI for $350 million, and former DeepMind research scientist Jason Ma. The company has raised over $140M, backed by top investors, including CRV and First Round.We're positioned to redefine the landscape of robotic automation. POSITION OVERVIEW We are developing next-generation advanced robotic platforms. We are looking for a highly capable Electromechanical Engineer to drive the R&D and rapid prototyping of our cutting-edge hardware. In this role, you will work hand-in-hand with our advanced research, teleoperation, and data teams to rapidly iterate on physical designs and validate new ideas before they are formalized for production. You will own the hardware at the system level. This means you will be building fast prototypes, driving full-stack integration, and acting as the technical bridge for our early-stage platforms. If you love building from scratch, quickly validating complex research concepts, and tearing systems down to see how they can be improved, this is the role for you. WHAT YOU WILL DO - Rapid Prototyping & Research Validation: Collaborate closely with the research and data teams to quickly iterate on electromechanical designs, building fast, functional prototypes to validate cutting-edge software, AI, and teleoperation concepts. - Cutting-Edge R&D: Design, build, and implement local hardware modifications, custom test rigs, and next-generation subsystems to accelerate our US research initiatives. - Full-Stack Integration: Work seamlessly across domains. Lead the local EE architecture (PCB design/review, power distribution), modify CAD models, and write/tweak firmware (C/C++) to ensure your prototypes operate perfectly. - Global Hardware Feedback Loop: Support our global hardware development cycle. Diagnose early-stage system bugs on incoming builds and translate your US-based research validations into actionable engineering feedback for our China team to implement in future production iterations. WHAT YOU’LL BRING - Education: BS or MS in Electrical Engineering, Mechatronics, Robotics, Mechanical Engineering, or a closely related field. - Core EE Expertise: 3+ years of experience in electrical design, including schematic capture, PCB layout, power systems (batteries, motor drivers), and sensor integration. - Firmware Fluency: Ability to read, write, and debug embedded C/C++ (microcontrollers, RTOS, communication protocols like CAN, SPI, I2C). - Mechanical Fluency: Familiarity with CAD (SolidWorks, Fusion360, etc.) and a practical understanding of motors, actuators, kinematics, and physical stress points. - The Agile Builder Mindset: You are highly self-directed and value speed and iteration. You are just as comfortable designing a new PCB architecture as you are tearing down a robot chassis to troubleshoot a system-level fault. - Communication: Exceptional ability to communicate complex technical concepts clearly across cross-functional (software/data) and global engineering teams. BONUS POINTS FOR - Direct experience in an R&D or advanced prototyping lab environment. - Previous experience collaborating with global hardware development teams to hand off prototypes for manufacturing. - Direct experience with advanced robotics, specifically mobile bases, robotic arms, or complex teleoperation setups. At Dyna Robotics, we build technology for the real world, which requires a team as diverse as the environments our robots inhabit. We are an equal opportunity employer c ... (truncated, view full listing at source)
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