Customer Enabling Engineer

Job Details: Job Description: The Role and Impact We are seeking a Sr. Principal Engineer, Customer Enabling to lead and drive innovation in Intel's cutting-edge assembly packaging technologies. In this role, you will play a pivotal role in shaping the future of assembly processes and equipment, ensuring Intel's leadership in delivering high-quality products to market. You will work at the heart of technology development, leveraging your expertise to optimize manufacturing processes and solve complex challenges that impact quality, reliability, and cost efficiency. As a recognized domain expert, you will influence technical direction across Intel and the broader industry, mentoring future leaders and driving meaningful advancements in packaging technologies. Your contributions will directly enable Intel to achieve its ambitious roadmap and deliver world-class solutions that power billions of devices worldwide. The Customer Enabling Engineer is responsible for developing and executing strategies that promote Intel Foundry's Advanced Packaging solutions to customers. This role involves engaging with customers to understand their needs, and ensuring end to end ownership of technical engagement. Some of the key responsibilities includes Be the center point of contact for all technical collaboration with the customer, that includes but not limited to Critical to Function Data, Schedule, demand/sample size, reliability requirements, certification, NPI and 1st Silicon coordination with customer etc. Collaborate with Customer Packaging team to translate product requirements into package architecture specification, co-define test vehicle and product strategy and manage the schedule, cycle time negotiation. Participate in technology tradeoff decisions ensuring packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones. Translate the requirements to the internal execution teams and manage customer dashboards via performance against execution (PAS) Collaborate with silicon and package execution leads to ensure high quality outcomes and aids in removing roadblocks. Participate and contribute in identifying critical technology solutions for future product needs. - Partner with design teams to ensure manufacturability of package layouts and processes. - Innovate by creating reliability requirements, acceleration methods, tools, and quality screens to proactively address packaging quality and reliability challenges. - Solve complex technical problems related to packaging processes and materials, providing expert consultation and responding to client requests or events. - Drive standardization of quality systems, product qualification, and methods to ensure excellence in manufacturing and meet product milestones. - Mentor and develop other technical leaders, cultivating a strong community of innovators who embody Intel's values. - Formulate technical strategy and align organizational goals with a vision for delivering leadership solutions in packaging technologies. Required Skills and Experience Demonstrated expertise in package design and development, manufacturing quality assurance, and process characterization. Demonstrated experience in Testing including Wafer and package Testing Proficiency in statistical methods, experimental design, and reliability modeling. Technical knowledge in package architecture, testing, and design for manufacturability. Proven ability to lead initiatives and deliver results through disciplined execution. Preferred Skills and Experience Strong mentoring and coaching skills, with a history of developing technical leaders. Exceptional communication and influence skills, with the ability to drive collaboration across diverse teams and stakeholders. Industry recognition for innovation and technical contributions in packaging technology. Learning agility and adaptability to rapidly changing environments and challenges. Strategic problem-solvin ... (truncated, view full listing at source)