Packaging Engineering Intern - Fall

Packaging Engineering Intern - Fall About Atomic Semi Atomic Semi is building a small, fast semiconductor fab. It’s already possible to build this with today’s technology and a few simplifications. We’ll build the tools ourselves so we can quickly iterate and improve. We’re building a small team of exceptional, hands-on engineers to make this happen. Mechanical, electrical, hardware, computer, and process. We’ll own the stack from atoms to architecture. Our team is optimistic about the future and we want to continue pushing the limits of technology. Smaller is better. Faster is better. Building it ourselves is better. We believe our team and lab can build anything. We’ve set up 3D printers, a wide array of microscopes, e-beam writers, general fabrication equipment - and whatever is missing, we’ll just invent along the way. Atomic was founded by Sam Zeloof https://www.youtube.com/@SamZeloof and Jim Keller https://en.wikipedia.org/wiki/Jim_Keller_(engineer). Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years. About the role We’re hiring Semiconductor Packaging Engineering Interns for the fall term. The internship begins in September, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology. Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here. Responsibilities - Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities - Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics - Collaborate with cross-functional teams to continuously improve fabrication processes and equipment - Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology) Required Experience - Pursuing a Bachelor’s Degree or higher in engineering - At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices - Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.) - Hands-on prototyping experience and the ability to move through design cycles quickly Nice-to-have - Proven experience in mechatronics or electromechanical system design - Familiarity with lasering and 3D printing (stereolithography) - Reliability testing, soldering, and reflow testing - Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.) Working at Atomic Semi We’re an early-stage hardware startup with solid funding, world-class advisors, and a lab/office in San Francisco, CA. Atomic Semi is committed to fair and equitable compensation practices. Hardware Interns are paid an hourly rate equivalent to an annualized range of $105,000-126,000, depending on experience and education level. This range assumes a 40-hour workweek and includes up to 10 hours of pre-approved weekly overtime, paid at 1.5x the base hourly rate. Actual earnings will vary depending on internship length and hours worked. Internship Benefits: - Housing Stipen ... (truncated, view full listing at source)