Advanced Packaging Technologist & Lead

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs. Cerebras' current customers include top model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras , to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference. Thanks to the groundbreaking wafer-scale architecture, Cerebras Inference offers the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation. Advanced Packaging Technologist Lead We are seeking an accomplished Advanced Packaging Technologist Lead to drive the development, integration, and deployment of next‑generation semiconductor packaging technologies. This role is critical in architecting and implementing advanced, high‑performance, and high‑density packaging solutions supporting cutting‑edge compute, AI, and heterogeneous integration platforms. Key Responsibilities Advanced Packaging Architecture Development Design and implement advanced semiconductor packaging technologies, including 2.5D/3D stacking, heterogeneous integration , high-bandwidth interconnects, and advanced power-delivery architectures. Lead RD in Chip-on-Wafer (CoW) and Wafer-to-Wafer (W2W) bonding approaches for high-density integration. Develop and optimize solutions using silicon interposers , Through-Silicon Vias (TSVs) , and multi‑layer RDL packaging to enable ultra‑high‑bandwidth and low‑latency connections. Engineer advanced packaging structures using low‑CTE substrates , FLEX interconnects , and organic or ceramic substrate technologies . Align internal architects and external partners to deliver manufacturable designs and steer our strategic technology direction . Leverage simulation-driven design to reduce hardware iteration cycles and ensure first-pass success in complex architectures. Assembly, Materials, Interconnect Technologies Drive technology innovation in advanced buildup substrates , including designs with and without embedded dies. Oversee flip-chip bonding processes using both solder balls and copper pillars . Lead development of substrate embedding for silicon dies, capacitors, passives, and other active components. Develop and refine advanced dicing methodologies (laser and mechanical saw) tailored for nanometer-class nodes. Select materials ; solder alloys, underfills, thermal interface materials (TIMs), and other key materials that enable high performance, manufacturability, and reliability Process Technology Reliability Manage package-level and board-level qualification , ensuring robust performance across thermal, mechanical, and electrical stress conditions Lead analysis and improvements in solder reliability , including temperature cycling, electromigration (EM), and stress modeling. Oversee ultra-thin die handling and processing for fragile, high-performance devices. Drive backside metallization and RDL process development to support advanced packaging roadmaps. Lead failure analysis when a new design fails a stress test and pivot the team toward a solution . Qualifications BS EE, MS EE or equivalent engineering discipline 10+ years of experience in advanced packaging Highly preferred: working knowledge of simulation tools (i.e. Ansys, Cadence, Abaqus) The base salary r ... (truncated, view full listing at source)