Foveros Direct Pathfinding Integration

Job Details: Job Description: Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations. Apply today to become part of the team shaping the future of semiconductor packaging technology. Apply scientific and engineering principles to design, develop, and qualify advanced packaging solutions and materials used to hold, display, dispense, and safely transport all types of products. Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking. Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities. Consult cross organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel's product distribution channel. Qualifications: Minimum Qualifications Bachelor's degree in Engineering, Materials Science, Chemistry, Physics, or a related field, and 6 years of relevant experience; or Master's degree in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4 years of relevant experience; or PhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4 years of relevant experience. Experience in packaging engineering, process development, and technology innovation. Experience with thermal, mechanical, and electrical design concepts related to semiconductor packaging. Expert in qualification testing, specification documentation, and packaging material certification. Preferred Qualifications Experience in advanced packaging technology development and strategic supplier management. Established track record in leading technology programs and engaging with cross-functional stakeholders. Experience with Hybrid Bonding Integration and Process development Experience participating in forums, task forces, or working groups driving defect reduction and process improvements. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits ... (truncated, view full listing at source)