Silicon Packaging Design Engineer

Job Details: Job Description: The Role and Impact As a Silicon Packaging Design Engineer, you will play a critical role in the development of advanced substrate designs that drive Intel's innovation and technological leadership. This position offers a unique opportunity to contribute to cutting-edge technologies by managing the end-to-end development process of substrate designs, from concept to tapeout. You will collaborate with silicon and hardware teams to optimize design performance, cost efficiency, and manufacturability, ensuring Intel remains at the forefront of high-performance applications. Your contributions will directly impact Intel's ability to deliver world-class solutions that address global challenges in computing. Key Responsibilities Drive the physical layout and routing of package designs, ensuring alignment with silicon, package, and board performance requirements. Conduct substrate fit and routing studies to establish design, performance, and cost tradeoffs. Define and implement substrate design rules, conducting internal and external reviews to maintain quality standards. Analyze data, resolve Design Rule Checks (DRCs), and optimize designs for manufacturability and performance. Collaborate with cross-functional teams to optimize pinout and silicon-package-board interactions. Complete documentation and collateral into the product lifecycle management system of record. Strong analytical ability and problem-solving skills, including debugging and providing innovative solutions. Qualifications: Minimum Qualifications This position is not eligible for Intel sponsorship. US Citizenship Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Material Sciences, with 0-1 years of relevant experience, or related field. Experience with package design tools such as Siemens Xpedition, Cadence Allegro Package Design, AutoCAD, or SolidWorks. Experience with physical layout aspects of substrate design, including custom layouts, floor plans, or schematic layout conversions. Experience microelectronic package or PCB physical layout design and manufacturing processes. Preferred Qualifications Master Degree in Electrical Engineering, Mechanical Engineering, or Material Sciences or related field. Experience in substrate design or I/O routing, or technology development. Experience with microelectronic package electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS. Experience with scripting using Python, VB, C, or similar languages. Join Intel and contribute to shaping the future of technology. Be a part of a dynamic team committed to delivering innovative solutions that address the needs of a rapidly evolving world. Apply today to take the next step in your career. Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marit ... (truncated, view full listing at source)