LTD Integration Engineer

Job Details: Job Description: The LTD Integration Engineer is a technical leader responsible for defining and executing advanced-node backend‑of‑line (BEOL) integration strategies within Intel’s leading-edge process technologies. This role delivers sustained, organization‑level impact, shapes technology direction from development through high‑volume manufacturing, and resolves high‑complexity integration challenges spanning devices, interconnect, and advanced packaging enablement. This position requires deep expertise operating at the intersection of Technology Development (TD), Pathfinding, and High‑Volume Manufacturing (HVM) in a logic foundry environment, with demonstrated ownership of critical BEOL process segments and strong cross‑organizational technical leadership. Key Responsibilities: Backend‑of‑Line Integration Ownership Own and drive an integrated BEOL process segment on advanced logic nodes (FinFET and beyond) during technology development, qualification, and manufacturing ramp, with full accountability for yield, reliability, performance, and manufacturability. Serve as the single‑point technical owner coordinating interactions with upstream FEOL/module teams and downstream packaging, test, and product engineering functions. Advanced Process & Feature Development Lead development and integration of new BEOL and packaging‑enabling process features, including but not limited to: Metal‑Insulator‑Metal (MIM) decoupling capacitors (high‑density and high‑performance variants) Through‑Silicon Via (TSV) and 3DIC integration schemes Backend passive structures, redistribution layers, bonding interfaces, and thermal/warpage mitigation features Translate system‑level product requirements into robust BEOL integration solutions that enable next‑generation mobile, HPC, and advanced compute products. Cross‑Technology & Cross‑Organization Leadership Drive cross‑technology process synergy strategies, aligning process integration, module development, tool selection, and manufacturing systems to achieve optimal performance, cost, and scalability. Act as a technical integrator across virtual factories, partner fabs, and global TD organizations to ensure consistent execution and fast issue resolution. Represent integration expertise in core teams, working groups, design‑technology co‑optimization (DTCO) forums, and executive technical reviews. Defect Reduction & Yield Optimization Lead large‑scale, cross‑flow defect reduction initiatives across BEOL, coordinating with multiple segment owners to resolve complex interactions affecting yield, reliability, and product robustness. Apply strong physics‑based root cause analysis and integration trade‑off judgment to drive sustained yield learning and manufacturability improvements. Qualification, Technology Transfer & HVM Enablement Define qualification strategies, reliability requirements, and implementation plans for complex BEOL process changes and new technology features. Drive technology transfer from TD into HVM, ensuring solutions are manufacturable, scalable, and production‑ready for high‑volume logic fabs. Support Process Design Kit (PDK) development, documentation, and customer enablement for new BEOL features and technology definitions. Execution, Delivery & Mentorship Execute development programs with urgency to meet aggressive internal milestones and external customer commitments in a foundry environment. Mentor and grow senior integration and module engineers, providing technical guidance, integration strategy direction, and development feedback commensurate with a technical leadership‑level role. Required Skills & Experience Core Experience Extensive experience in Technology Development, Pathfinding, and/or Research & Development for advanced logic technologies. Proven success in a high‑volume logic foundry environment, with direct ownership of integration deliverables from development through manufacturing ramp. Demonstrated experience transitio ... (truncated, view full listing at source)