Advanced Packaging SI/PI Engineer

Advanced Packaging SI/PI Engineer About Etched Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners. Intense focus on pushing what is possible in power delivery and high-speed signaling for transformer-purposed silicon. Key Responsibilities - SI/PI analysis of designs and optimization within 2D/2.5D/3D packages - Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performance - Drive SI requirements into interposer/substrate layout (high-speed routing: 112G/224G) from preliminary design through tape-out. - Drive PDN design and decoupling strategy across substrate and interposer, owning DC IR drop, dynamic IR drop, and impedance targets across all rails. - Own ball map / C4 / BGA pin assignment from soft freeze through final freeze in partnership with package layout, ASIC PD, and board layout teams. - Support board-level SI/PI and rack-level scale-up topology studies, including rack test vehicle design and cable characterization. - Participating in cross-functional meetings and design reviews. You may be a good fit if you have (Must-have qualifications) - Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field with a strong understanding of signal integrity and power integrity concepts and fundamentals. - 8+ years of SI/PI experience on high-performance ASIC, processor, or accelerator platforms. - Proven experience defining and closing PDN for high-power silicon, including substrate and PCB plane design, decap strategy, and dynamic IR/EM analysis. - Experience with developing systems with high-speed interfaces like HBM, SerDes and D2D interfaces. - Hands-on expertise with one or more of: ANSYS HFSS / SIwave, Cadence Sigrity (PowerSI / PowerDC), Keysight ADS. - Experience with CoWoS or equivalent advanced packaging materials and technologies including interposer SI/PI implications, C4 bump planning, and substrate stack-up trade-offs. - Track record of designing and correlating SI/PI test vehicles against silicon measurement during bring-up and lab characterization. - Strong analytical and communication skills, comfortable presenting risk, sign-off status, and trade-offs to cross-functional leadership. - Deeply creative and able to think from first principles. Strong candidates may also have experience with (Nice-to-have qualifications) - Familiarity with full RTL-to-GDSII context and how PD decisions interact with package and board PDN. - Experience with multi-die, 2.5D, or 3D packaging signoff, including chip-package-system (CPS) co-design. - Project management experience coordinating across internal teams, OSAT partners, and PCB ODMs. - Familiarity with transformer models, accelerator architectures, or HPC system design. - Startup experience or comfort working in fast-paced environments. Benefits - Medical, dental, and vision packages with generous premium coverage - $500 per month credit for waivi ... (truncated, view full listing at source)