Die Bonding Specialist, Silicon Assembly (Starlink)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. DIE BONDING SPECIALIST, SILICON ASSEMBLY (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership. The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step. RESPONSIBILITIES: Operate and program die bonding equipment, including automated pick-and-place systems, epoxy dispensers, flip-chip bonders, and eutectic die attach tools, to achieve accurate die placement with micron-level precision and minimal tilt Develop and optimize bonding recipes by adjusting parameters such as dispense volume, cure temperature, pressure, and reflow profiles to ensure void-free bonds, strong adhesion, and thermal reliability Perform in-process inspections using tools like confocal scanning acoustic microscopy (C-SAM), X-ray imaging, and shear testers to evaluate bond quality, alignment accuracy, and defect rates such as delamination or voids Troubleshoot process variations, equipment downtime, and material incompatibilities through root cause analysis, implementing corrective actions to improve cycle time and first-pass yield Collaborate with engineers cross-functionally to integrate die bonding into the full packaging flow, supporting qualifications for new die sizes, substrates, or new product introduction (NPI) for advanced packaging formats Document process data, generate reports on key metrics, participate in design of experiments (DOE) for material and process enhancements/improvements in yield/efficiency uptime Maintain cleanroom standards, including ESD protection, adhesive handling protocols, and safety procedures for high-temperature bonding operations Support inventory control for bonding materials (e.g., epoxies, solders, fluxes) and assist in tool qualifications and preventive maintenance schedules BASIC QUALIFICATIONS: High school diploma or equivalency certificate 3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline PREFERRED SKILLS AND EXPERIENCE: Bachelor's degree in an engineering, math or science discipline 6+ years of hands-on experience in semiconductor die bonding or die attach processes within a packaging or assembly environment Proficiency with die bonding techniques, including conductive adhesives, solder reflow, and ultrasonic methods, with knowledge of material interactions and thermal management Familiarity with data analysis and process control tools (e.g., Excel, SPC software) for yield tracking and variability reduction Ability to work in a shift-based cleanroom, including nights and weekends, with excellent manual dexterity for fine assembly tasks Strong commitment to quality and safety in a high-volume, precision-driven setting Experience with advanced die bonding for heterogeneous integration, such as chiplets, fan-out wafer-level packaging (FOWLP), or high-power devices Certification in semiconductor packaging (e.g., SEMI, IPC standards) Background in lean manufacturing, failure analysis (e.g ... (truncated, view full listing at source)