Technical Director, Advanced Package

Assembly
South Korea > IcheonPosted 24 February 2026

Job Description

<div class="content-intro"><p> </p> <p><strong>Step into a career with ASM, where cutting edge technology meets collaborative culture. </strong>​</p> <p>For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. </p></div><p><strong>Job's mission</strong></p> <p>Tech Director for SK Hynix is a strategic business and technology leader, core to the long-term success of ASM’s business at SK Hynix. With deep expertise in semiconductor technology and a particular emphasis on advanced packaging, the preferred candidate will build influential customer relationships. The Technology Director will lead service, support, and process engineering teams globally to deliver targeted, high-performance solutions, coordinating with ASM’s worldwide technology resources.</p> <p><strong>What you will be working on</strong></p> <ul> <li>Manage SK Hynix account globally for all technology-related matters, with focus on advanced packaging applications within ASM’s product suite.</li> <li>Build strong technical relationships with customers and related stakeholders.</li> <li>Understand customer’s advanced packaging roadmap and align product strengths and competitive insights with account strategy.</li> <li>Monitor closely the program progress and potential issue. Adjust strategies as needed.</li> <li>Align with BU on progress and issues to develop follow-up plan</li> <li>Anticipate future advanced packaging needs and foster long-term innovation and partnership with the customers.</li> <li>Develop, maintain, and ensure the relevance of technical information used by internal and external stakeholders.</li> <li>Ensure communication vehicles, e.g. telephone, email, and presentation, etc. are able to facilitate efficient and consistent customer follow-up.</li> <li>Drive continuous improvement of the customer experience through team, process and support tool development.</li> <li>Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience.</li> <li>Drive projects across multiple customer sites that secure business and build trust in ASM’s capabilities. Coordinate management reviews and alignment.</li> <li>Win customer trust as technical expert/leader</li> </ul> <p><strong>What we are looking for</strong></p> <ul> <li>At least 15 years of experience in semiconductor capital equipment, working with SK Hynix Process Development Team is preferred</li> <li>Specific focus on Deposition system in Semiconductor Field is a must have. (advanced packaging development experience is a plus)</li> <li>Knowledge of Thin film /Diffusion deposition systems</li> <li>in Engineering discipline is preferred/ MS in Engineering or above. (Ph.D preferred)</li> <li>Good communication skill with customer RD, Manufacturing Purchasing with understanding of technology and the Products.</li> <li>Good internal communication and reporting skill in English</li> <li>Keep interest in new technology in semiconductor device manufacturing</li> </ul> <p><em><u>Leadership Capabilities</u></em></p> <ul> <li>Results Orientation – with a strong drive to improve business results, an ability to make decisions, and a desire to execute flawlessly. High energy is critical with a willingness to “roll up the sleeves” and get the job done.</li> <li>Business Acumen – including an understanding of business strategies, competitive challenges and the f ... (truncated, view full listing at source)