Process Engineering Internship/Co-Op (Summer/Fall 2026)
Freeform Future CorpLos Angeles, CA (On-site)Posted 12 March 2026
Job Description
PROCESS ENGINEERING INTERNSHIP/CO-OP (SUMMER/FALL 2026)
Freeform builds AI-native manufacturing systems that unify software, hardware, and physics to produce industrial-scale parts at the speed of human ideation. By treating manufacturing as a single integrated system, we unlock a new era of innovation where complex hardware is designed, built, and scaled without limits.
As a Process Engineering Intern at Freeform, you will help develop and refine novel processes for some of the world’s most advanced metal 3D printing systems. You will work closely with experienced engineers to study complex, multi-physics behavior within the printing process, building a foundational understanding of the system and applying those insights to support the development of next-generation processes. You’ll collaborate with mechanical, software, and simulation engineers to analyze large in-situ data sets and post-print material characteristics, contributing to rapid iteration and continuous improvement of the printing technology using data-driven and machine-learning-enabled approaches.
3D printing experience is not required to be successful here - we look for smart, motivated, collaborative engineers who love solving hard problems and creating amazing technology!
Responsibilities:
Assist the Process Engineering team in developing a deep understanding of the metal additive process and hardware operation by analyzing massive in-situ data sets to gain insight into physical mechanisms of the printing process
Execute experiments and analyze data to improve metal additive processes
Perform post-build metrology measurements and analysis of material properties such as tensile strength, surface roughness, and alloy microstructure
Assist in the development and implementation of tool qualification procedures
Basic Qualifications:
Currently pursuing Bachelor's degree in material science, physics, or similar engineering discipline
Experience with experimental design and statistical data analysis
Strong data analysis skills and ability to interpret important information from extremely large data sets
Experience with Python and/or MATLAB
Nice to Have:
Undergraduate research experience in material science, physics, mechanical engineering
Process development experience from cutting edge industries such as semiconductor, solar, or displays
Experience with statistical data analysis software such as R, JMP, or Minitab
Passion for improving the state of metal 3D printing
Comfortable working in fast-paced, ambiguous environments and iterating quickly (comfortable building the plane as we fly it)
Strong communicator who collaborates across disciplines and proactively seeks support when needed
Willing to take ownership of tasks big and small, with a hands-on, problem-solving mindset
Strong work ethic with a refuse-to-fail mindset
Demonstrated indicators of excellence and/or achieving success against adversity (i.e. top academic performance, leadership in engineering clubs, first-generation college student, or other examples of resilience and achievement)
Location:
Based in Hawthorne, our vertically integrated facility brings technology development, RD, and production together under one roof. We operate at the center of LA’s deep tech ecosystem, surrounded by some of the most ambitious hardware innovation happening anywhere in the country.
What We Offer:
We have an inclusive and diverse culture that values collaboration, learning, and making deliberate data-driven decisions
We offer a unique opportunity to be an early and integral member of a rapidly growing company that is scaling a world-changing technology
Compensation and Benefits
The compensation for this role:
Engineering Intern/Undergraduate: $30/hour
Engineering Intern/Masters: $32.50/hour
Engineering Intern/PhD: $35/hour
Relocation assistance
provided
Free daily catered lunch and dinner, and fully stocked kitchenette
Casual dress, flexible work hours, and regular catered team b ... (truncated, view full listing at source)
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