Senior Engineer I, Field Process (Boise, ID)

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. As a Senior Engineer I, Field Process, you will help expand ASM’s advanced film technologies at our customer’s Boise site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical link between customer engineering teams and ASM’s global Business Unit, ensuring new products and processes are introduced smoothly and successfully. Your work directly supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and customer partnership. What you will be working on Lead NPI by developing deep expertise in new ASM deposition processes and hardware and driving introduction and transfer to fabs. Partner with field, BU, and customer teams to troubleshoot issues, run on‑site experiments, and deliver process or hardware improvements. Analyze system and process performance against technology‑node requirements, using structured root‑cause problem solving. Proactively manage risks and escalations to maintain scope, timelines, IP discipline, and customer alignment. Capture NPI learnings and support transfer to high‑volume manufacturing through BKMs and documentation. What we are looking for MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics. Hands-on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors. Demonstrated troubleshooting and structured problem-analysis skills gained through internships, lab work, or research projects (e.g., KT, FMEA, Ishikawa, 7-step methodologies). Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings. Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin film characterization through coursework, lab work, or internships. Willingness and ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations. Strong verbal and written communication skills, with the ability to clearly explain technical concepts. Ability to maintain confidentiality and uphold IP boundaries What sets you apart Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment. Demonstrated success optimizing deposition processes in research, pilot, or high-volume manufacturing–adjacent environments. Exposure to customer-facing technical discussions, presentations, or technical reviews through internships or collaborative research. Experience supporting process transfer, scale-up, or qualification activities in academic, pilot, or industrial settings. Experience collaborating cross-functionally and contributing to structured action plans during technical challenges or escalations. Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of w ... (truncated, view full listing at source)