Customer Enabling Engineer

Job Details: Job Description: The Role and Impact: The Customer Enabling Engineer is responsible for developing and executing strategies that promote Intel Foundry's Advanced Packaging solutions to customers. This role involves engaging with customers to understand their needs and ensuring end to end ownership of technical engagement. Some of the key responsibilities includes • Be the center point of contact for all technical collaboration with the customer, that includes but not limited to Critical to Function Data, Schedule, demand/sample size, reliability requirements, certification, NPI and 1st Silicon coordination with customer etc. • Collaborate with Customer Packaging team to translate product requirements into package architecture specification, co-define test vehicle and product strategy and manage the schedule, cycle time negotiation. • Participate in technology tradeoff decisions ensuring packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones. • Translate the requirements to the internal execution teams and manage customer dashboards via performance against execution (PAS) • Collaborate with silicon and package execution leads to ensure high quality outcomes and aids in removing roadblocks. • Participate and contribute in identifying critical technology solutions for future product needs. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Bachelor's degree in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related STEM field with 9 years of experience. OR Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related STEM field with 6 years of experience. OR Ph.D degree in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related STEM field with 4 years of experience. Experience listed above should be a combination of the following: • Advanced Packaging Processing, fabrication including process flows, FMEA, PADK and Design rules • Product Life Cycle and Packaging Reliability Basics • Program Management including proficiency with Microsoft Project and Model based problem Solving Preferred Qualifications: 8 years of experience in the areas below: Direct working experience in one or more of the following disciplines: advanced packaging technology integration, SI/PI assessment, Packaging architecture definition, Packaging Reliability Engineering, Supply Chain Management in Advanced packaging ecosystem Familiarity with die and package layout tools including the ability to view and interpret designs. Familiarity with typical assembly and test flows and fundamental Package DRs and the drivers. Strong interpersonal and communication skills to be able to work with a broad set of stakeholders and customers, A Business Degree such as MBA will be a plus for the potential candidates Managing large number of stakeholders and delivering projects on time with ability to communicate to executives with recommendations on path forward Proven ability to lead projects that require both strategic planning and daily tactical execution: mapping and multitasking experience will be greatly beneficial for this role. Materials and LYA/FA characterization techniques Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and p ... (truncated, view full listing at source)