Semiconductor Packaging Engineering PHD Intern
IntelUS, Arizona, Phoenix$73k – $135kPosted 27 March 2026
Tech Stack
Job Description
Job Details:
Job Description:
Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below.
Life at Intel
Contributes to the design and optimization of manufacturing engineering processes and factory operation. Assists in evaluating equipment performance, implementing corrective actions, and supporting process improvements. Collaborates with engineering and operations teams to enhance production efficiency and product quality. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment
Major duties and responsibilities:
o Develop and validate computational fluid dynamics (CFD) models to simulate specific assembly processes of advanced semiconductor packages. Perform simulations to evaluate flow, capillary action, porous media properties and process optimization across a wide range of package architectures.
o The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
o The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
o The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
Pursuing PhD degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with focus on computatinal fluid dynamics and two phase flows.
Preferred Qualifications:
Experience with:
Commercial CFD software such as: Ansys Fluent, Simulia Digital Rock, FlowScience Flow3D
Surface energy minimization software such as Surface Evolver.
Material characterization: Rheology, surface energy, contact angle
Machine learning AI
Semiconductor packaging
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Benefits at Intel
Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits | Intel Careers for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.
Job Type:
Student / Intern
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitmen ... (truncated, view full listing at source)
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