Transport Media and Materials Engineer

Job Details: Job Description: As a Transport Media and Materials Engineer, you will design and develop shipping packaging solutions for wafer‑level, component‑level, and system‑board products supporting Intel products, foundry services, and warehouse logistics. Your work will include creating new packaging designs, defining requirements, conducting qualification testing, and managing project timelines to meet startup schedules and cost targets. This role also involves leading pathfinding projects to advance packaging technology, performing materials research on corrugated papers and cushions, and providing consultation on packaging improvements with a focus on cost, quality, and environmental impact. Expected professional traits: Demonstrated problem‑solving abilities and disciplined execution Experience collaborating across teams to support innovation and continuous improvement Familiarity with reliability acceleration methods and tools Strong communication skills and ability to consult on packaging technology challenges Proven ability to deliver solutions aligned with customer needs and product roadmaps This position is not eligible for immigration sponsorship. Qualifications: Minimum Qualifications Bachelor’s degree in Packaging Engineering, Mechanical Engineering, or a related field 3 years of packaging engineering experience (electronics/semiconductor preferred) The years of experience must include: Proficiency with packaging design software and CAD tools Knowledge of packaging materials and testing standards (ASTM, ISTA) Strong project management and analytical skills Preferred Qualifications Master’s degree in engineering Semiconductor packaging experience Packaging certifications (CPP, IOPP) Six Sigma/Lean manufacturing knowledge Familiarity with international shipping regulations Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range ... (truncated, view full listing at source)