Quality and Reliability Engineer
IntelMalaysia, PenangPosted 27 March 2026
Tech Stack
Job Description
Job Details:
Job Description:
The Role and Impact:
We are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs.
The scope will be broad including WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly).
You will play a critical role in ensuring our products and processes meet the highest quality and reliability standards.
This position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction.
By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader.
This role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices.
Key Responsibilities:
Manage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive rapid product risk assessments and discrepant material dispositions (3D). Effectively communicate with internal Foundry partners and Intel customers
Collaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's)
Understanding of thermomechanical interaction between wafer, die and package to advise and provide feedback to technical teams as needed.
Develop and implement systems for early detection and containment of excursions.
Own and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods
Support factory Operations and output, e.g. daily material disposition and inking for meeting commits
Support technology certification and transfer activities collaborating with TD partners
Use data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data and effectively flag any risks
Extract insights from structured and unstructured data using statistics and machine learning to determine product disposition.
Represent the quality and reliability function and be the voice of customer in internal forums, making recommendations to improve system, process, and product quality and reliability.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor's degree / Master's degree / Ph.D. degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study, with relevant work experience in semiconductor Mfg, chip assembly and test, or packaging
5 years of relevant work experience (in semiconductor Mfg, chip assembly and test, or packaging)
Expertise in quality and reliability methodologies, excursion management, and failure mode analysis.
Understanding reliability failure and physics of failure mechanisms
Familiar with QnR Quality Systems and tools
Strong skills with data extraction and analysis tools, and custom scripts. Familiarity with SQL, JMP, JSL, and statistical analysis techniques
Experience with data mining to synthesize insights from structured and unstructured data
Strong verbal and written communication, and effective meetings skills
Collaboration, influencing, stakeholder management and teamwork skills across levels
Motivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes
Ability to work with minimal supervision in a team environment, and flexibility to work across technical areas
Have a passion for driving quality culture and Continuous Improvement with Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st
Demonstrate strong Qua ... (truncated, view full listing at source)
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