Quality and Reliability Engineer

Job Details: Job Description: The Role and Impact: We are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs. The scope will be broad including WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly). You will play a critical role in ensuring our products and processes meet the highest quality and reliability standards. This position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction. By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader. This role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices. Key Responsibilities: Manage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive rapid product risk assessments and discrepant material dispositions (3D). Effectively communicate with internal Foundry partners and Intel customers Collaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's) Develop and implement systems for early detection and containment of excursions. Own and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods Support factory Operations and output, e.g. daily material disposition and inking for meeting commits Support technology certification and transfer activities collaborating with TD partners Use data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data Extract insights from structured and unstructured data using statistics and machine learning to determine product disposition. Qualifications: Minimum Qualifications: Bachelor's degree or Master's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with relevant work experience in semiconductor Mfg, chip assembly and test, or packaging 3 years of relevant work experience (in semiconductor Mfg, chip assembly and test, or packaging) Experience in quality and reliability methodologies, excursion management, and failure mode analysis. Proficiency in statistics and data analytics tools for quality and reliability assessments Experience with data mining to synthesize insights from structured and unstructured data Familiar with QnR Quality Systems and tools Effective verbal and written communication, and effective meetings skills Motivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes Demonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st Be comfortable working in a diverse environment and across geographies Preferred Qualifications: Influencing skills to drive a quality-focused mindset across the organization. Proven ability to manage impactful Material Review Boards (MRBs). Join us to shape the future of manufacturing quality and reliability at Intel and make a lasting impact on our products, processes, and customer experiences. Apply now to be part of this exciting journey. Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging ... (truncated, view full listing at source)