Advanced Packaging Module Development Engineer

Job Details: Job Description: The Role and Impact Join Intel's Advanced Packaging Technology Development team as an Advanced Packaging Research and Development Engineer where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you will play a critical part in optimizing processes and equipment to meet Intel's ambitious roadmap for assembly packaging platform technologies. In this role, you will be responsible for process and equipment development at the module level, driving solutions that meet Intel’s stringent requirements for quality, reliability, yield, cost, and productivity. You will apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability aligned with Intel’s advanced packaging roadmap. Working within a highly cross-functional, world-class engineering team, you will help solve complex technical challenges, introduce innovative process improvements, and ensure Intel remains a technology leader in advanced packaging. Key Responsibilities will include but are not limited to: Develop and optimize panel level processes and equipment to support Intel's advanced packaging technologies. Establish process specifications and equipment configurations for new technologies and integrate these into production workflows. Apply principles of design of experiments (DoE) to characterize process windows and understand interactions between equipment, materials, and processes. Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity. Collaborate with cross-functional teams to identify and mitigate risks in packaging technology development and ensure milestone achievement. Lead efforts to innovate and improve equipment and processes using statistical methods and experimental design. Document process improvements and advancements through technical white papers and data analysis reports. Engage with internal and external stakeholders to address packaging challenges and deliver solutions aligned with Intel's goals. Behavioral Traits & Attributes that we are looking for: Demonstrates strong ownership and accountability for technical deliverables. Applies a data-driven, structured approach to problem solving and decision-making. Thrives in collaborative, cross-functional environments. Communicates technical information clearly and effectively. Adaptable and comfortable working in fast-paced, evolving development settings. Driven by continuous learning and process improvement. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Note: This position is not eligible for Intel immigration sponsorship. Minimum Qualifications and Experience : Candidate must meet one of the following: Must possess a Bachelor's degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field. Additionally, candidate must have 4 years of experience in the following: Experience with process development, equipment adjustment, and manufacturing process control. Design of experiments (DoE) principles and statistical data analysis. Experience in process characterization and statistical process control methodologies. Analytical skills and experience troubleshooting integrated technology issues. Experience with materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM. Preferred Qualifications and Experience : Master's degree with 3 years or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field. Proficiency in statistical ... (truncated, view full listing at source)