Module Development Engineer- Hybrid Bonding
IntelUS, Oregon, Hillsboro$99k – $140kPosted 8 April 2026
Job Description
Job Details:
Job Description:
Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
Join us and build on our legacy of innovation and collaboration as we deliver world-changing technology that improves the life of every person on the planet.
In Oregon Advanced Packaging (ORAP) Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on the planet.
Oregon Advanced Packaging (ORAP) is looking for a highly energetic and innovative Module Development Engineer, who has a strong technical background to drive for the best equipment performance and product quality in a safe and cost-effective manner. This role requires regular onsite presence to fulfill essential job responsibilities.
Job Scope includes but are not limited to:
Owning execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required
Engaging in hands-on training and development activities, managing process equipment and hardware, ensuring optimal functionality and availability.
Owning process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites.
Assessing, improving, and optimizing processing techniques and methods used in high-volume manufacturing settings, ensuring safety and quality standards are met.
Improving safety, maintenance, and operational procedures for engineers and technicians
Providing expert technical support to manufacturing operations, aiding in the resolution of complex issues through comprehensive analysis of variable factors.
Owning New Product Introduction, leading integration of new technologies, ensuring seamless transitions.
Owning development and optimization of excursion prevention systems for the equipment and process.
During factory ramps, owning equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).
The ideal candidate must have/be:
Strong analytical and problem-solving skills.
Excellent communication and teamwork abilities.
Able to work onsite in Ronler Acres facilities in Hillsboro, OR.
Eagerness to learn and adapt in a fast-paced environment.
This is an onsite position only. (Relocation Assistance will be provided)
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience.
Minimum Qualifications:
Education : MS Degree in mechanical engineering, Electrical and/or Electronic Engineering, Chemical Engineering, Computer Engineering, or related STEM field.
Experience :
Interested in fab process with database experience and analysis knowledge in Excel, JMP, Power Query, SQL, MATLAB, SOLIDWORKS, JMP, Power BI, Arduino, C, Python, MES.
Technical knowledge in statistical process control, commonality analysis, design of experiment and failure modes/effects analysis (FMEA).
Preferred Qualifications:
Graduates with up to 2 years of relevant experience; prior experience in the semiconductor industry and a manufacturing ... (truncated, view full listing at source)
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