Silicon Packaging Engineer - Wireless Communications Solutions

Job Details: Job Description: About This Opportunity Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities. WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms. The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions. WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers. The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements. WCS is committed to advancing wireless communication capabilities, supporting Intel’s leadership in the wireless ecosystem, and enabling next-generation connected experiences. As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization. What You'll Do Strategic Leadership & Architecture: Translate product requirements into comprehensive package architecture specifications Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards Lead Package level simulations (Mechanical and Thermal) to address specific risk areas Define overall product package performance specifications and drive technology certification Oversee end-to-end package development processes, from design through production Technical Excellence & Innovation: Troubleshoot complex packaging problems and develop innovative, cost-effective solutions Research packaging assembly materials and properties, establishing specifications for suppliers Perform mechanical and reliability simulations to optimize package design Conduct thermal performance simulations using predictive FEA analysis Cross-Functional Collaboration: Partner with silicon, hardware, and package design teams to ensure high-quality deliverables Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers Support product co-design and layout teams as manufacturing liaison Collaborate with Quality & Reliability teams to ensure products meet specifications Complete DFMEA assessments with assembly suppliers to evaluate technology risks Manufacturing & Process Management: Ensure seamless transition from design to high-volume production Design and validate Test Vehicles for process characterization Provide consultation on packaging improvements and process optimization Qualifications: What We're Looking For Education & Experience Minimum Requirements: Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field 4 years industry experience OR  Master's degree in relevant field 3 years experience OR  PhD in relevant field 1 years experience Required Technical Skills 2 years  package assembly technology development experience 2 years  packaging physics (mechanical and thermal) and/or materials experience 2 years  package assembly manufacturing processes and HVM ramp experience Preferred Qualifications Semiconductor device physics and process engineering experience RF Component Packaging experience (highly valued for wireless products) Testing systems experience with hardware/software (Matlab, LabView) Essential Skills Strong project management capabilities Proficiency in Microsoft Office Suite Excellent communication and presentation abilities Self-driven with strong problem-solving tenacity Action-oriented mindset Why This Role Matters You'll be at the foref ... (truncated, view full listing at source)