Yield Engineer On Shift

Job Details: Job Description: Join Intel's Advanced Packaging Team as part of the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading-edge, high quality, and cost effective substrate packaging solutions. Become part of SPTD to help us advance this mission while contributing to an exceptional workplace culture. Role Overview: Yield Engineer On Shift (YEOS): As a YEOS engineer, you will provide critical factory support by addressing equipment, process, and product issues in real time to enable uninterrupted 24x7 lot movement through the manufacturing line. You will respond to process deviations, perform error recovery, manage lot dispositions, support new tool enabling, and handle a variety of ad hoc tasks within your functional area. Key Responsibilities (include but are not limited to): Receive written and verbal passdown from tool owners and previous shift peers. Execute tasks based on shift priorities and escalate issues following the calling tree when roadblocks arise. Perform key shift activities such as tool troubleshooting, recipe modifications, PIL reviews and approvals, executing non standard procedures (e.g., visual inspections, engineering scans and basic analysis), and other factory required tasks. Write and update specifications and RFCs after reviews with tool owners and internal stakeholders including defect reduction teams. Provide thorough written and verbal passdown to the incoming shift, ensuring clear, structured communication of activities, encountered issues, and detailed observations that support effective resolution. The ideal candidate will demonstrate the following behavioral traits: Strong problem solving and troubleshooting skills. Effective verbal and written communication skills, with a willingness to collaborate closely with peers, engineers, and customers. Flexibility to support night and weekend shifts over extended periods. Skills to learn quickly and efficiently handle new tasks. Capability to work with minimal supervision and adapt to rapidly changing priorities. Self driven mindset with the skills to manage individual responsibilities while contributing to team objectives. Strong documentation skills, including careful analysis of observations and well reasoned conclusions. Qualifications: Minimum Requirements: Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1 years of relevant experience. OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline. Experience with defect metrology or yield tool sustenance, RFC setup, and SPC. Preferred Qualifications: 1 years of experience in semiconductor packaging or substrate manufacturing. Prior experience working night and weekend shifts. Job Type: Experienced Hire Shift: Shift 2 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, s ... (truncated, view full listing at source)